Micro-Fluidic and Micro-electromechanical System Applications

1. Introduction. Part 1: Mechanical Approaches. 2. Micro-Grinding Process of Glass Substrates. 3. Ultrasonic Machining of Glass Substrates. 4. Sandblasting of Glass Substrates. Part 2: Chemical Approaches. 5. Chemical Etching of Glass Substrates. 6. Fabrication of TGV's by ECDD process for MEMS packaging applications. 7. ECD milling of glass for micro fluidic and RDL applications. Part 3: Plasma Approach. 8. Reactive Ion Etching of Glass Substrates. Part 4: High Temperature Approaches. 9. Glass Reflow of Glass Substrates. 10. Microwave Machining of Glass Substrate for Micro Hole Fabrication. 11. Laser Machining of Glass Substrates. Part 5: Hybrid Approach. 12. Triplex hybrid method for glass processing: Laser and Ultrasonic assisted Electrochemical discharge machining. Part 6: Post Processing Approach. 13. Post processing of glass substrates for Micro-Fluidic and MEMS applications.14. Conclusions.

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• Tecnologia da cerâmica e do vidro
• Design de produtos

microsystem device fabrication;glass substrate machining;chemical etching techniques;plasma-assisted processing;ultrasonic micro-machining;advanced sensor integration;hybrid machining methods for MEMS