Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
portes grátis
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Chiang, Kuo-Ning; Lau, John
Springer Verlag, Singapore
04/2026
320
Dura
Inglês
9789819568901
Pré-lançamento - envio 15 a 20 dias após a sua edição
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Advanced Packaging.- Cu Hybrid Bonding.- Glass Packaging.- CoPackaged Optics (CPO).- Characterization of Low Loss Dielectric Materials for Speed and Frequency Applications.- Fatigue and Fracture Models for Electronic Packaging.- AI and Machine Learning Algorithms.- Modeling and Design Simulation Technology.- Integrating AI with Design Simulation for Advanced Packaging.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Cu-interconnects;Glass-core substrate ;Photonic IC and Electronic IC;Fatigue-Fracture;AI-assisted simulations;Reliability
Advanced Packaging.- Cu Hybrid Bonding.- Glass Packaging.- CoPackaged Optics (CPO).- Characterization of Low Loss Dielectric Materials for Speed and Frequency Applications.- Fatigue and Fracture Models for Electronic Packaging.- AI and Machine Learning Algorithms.- Modeling and Design Simulation Technology.- Integrating AI with Design Simulation for Advanced Packaging.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
