Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
portes grátis
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Cepeda-Rizo, Juan; Gayle, Jeremiah; Ravich, Joshua
Taylor & Francis Ltd
12/2021
290
Dura
Inglês
9781032160818
15 a 20 dias
612
Descrição não disponível.
Introduction. New Space. Thermal/Structural Challenges in Miniaturizing. Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and Pressure. Characterization and Modeling of PWB Warpage and its Effect on LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case Studies. Random Vibration Structural Analysis and Mile's Equation. Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector. Operational Case Studies - Mars Surface Operations. Operational Case Studies - Dawn Asteroid Mission. Standards.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Heat Pipes;MSL.;Thermal Interface Material;PWB;Launch Vehicle;NASA Jet Propulsion Laboratory;Eutectic Tin Lead Solder;SOLIDWORKS Simulation;Out-of Plane Displacement;Thermal Vacuum Test;Heat Spreader;INTEROFFICE MEMORANDUM;Junction Temperature;Nusselt Number;Thermal Conductivity Measurement;Switch Board;Out-of Plane Deflection;Wickless Heat Pipe;Thermal Adhesive;Immersion Cooling;Evaporator Heater;Finite Difference Methods;PSD Curve;Die A2;Thermal Interface
Introduction. New Space. Thermal/Structural Challenges in Miniaturizing. Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and Pressure. Characterization and Modeling of PWB Warpage and its Effect on LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case Studies. Random Vibration Structural Analysis and Mile's Equation. Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector. Operational Case Studies - Mars Surface Operations. Operational Case Studies - Dawn Asteroid Mission. Standards.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Heat Pipes;MSL.;Thermal Interface Material;PWB;Launch Vehicle;NASA Jet Propulsion Laboratory;Eutectic Tin Lead Solder;SOLIDWORKS Simulation;Out-of Plane Displacement;Thermal Vacuum Test;Heat Spreader;INTEROFFICE MEMORANDUM;Junction Temperature;Nusselt Number;Thermal Conductivity Measurement;Switch Board;Out-of Plane Deflection;Wickless Heat Pipe;Thermal Adhesive;Immersion Cooling;Evaporator Heater;Finite Difference Methods;PSD Curve;Die A2;Thermal Interface
