Key enabling technologies for future wireless, wired, optical and satcom applications
portes grátis
Key enabling technologies for future wireless, wired, optical and satcom applications
Debaillie, Bjoern; Busson, Pierre; Steikuniene, Urte; Gaquiere, Christophe; Brunier, Francois; Belot, Didier; Ferrari, Philippe
River Publishers
11/2024
180
Dura
9788770046657
Pré-lançamento - envio 15 a 20 dias após a sua edição
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Preface Editors' Biography List of Contributors List of Figures List of Tables 1 B55X: A SHIFT in STMicroelectronics BiCMOS Technologies 2 RF Technology Roadmap for 5G and 6G RF Front-end Systems 3 Advanced Substrate Technologies for Sub-THz Era 4 A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities 5 The Impact of Irradiation on DC Characteristics and
Low-Frequency Noise of Advanced SiGe:C HBTs 6 D-band Modulated Signal Generation using Photonics Techniques 7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024) 8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital?Analog Converters in Coherent Optical Transmission Systems 9 Challenges for 2.5D and 3D Integration of InP HBT Technology 10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method 11 D-band Phased Array Antenna Module for 5G Backhaul 12 Sub-THz Transceiver Design for Future Generation Mobile Communications 13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array 14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends 15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications 16 Post-process Substrate Porosification for RF Applications 17 A Multi-standard RF Bandpass Sigma-Delta ADC 18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies 19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach 20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems 21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond 22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications 23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges 24 Advanced Packaging Solutions for mmWave Applications 25 Modular 3D mmW and THz Packaging Concepts and Technologies 26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands 27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules Index
Low-Frequency Noise of Advanced SiGe:C HBTs 6 D-band Modulated Signal Generation using Photonics Techniques 7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024) 8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital?Analog Converters in Coherent Optical Transmission Systems 9 Challenges for 2.5D and 3D Integration of InP HBT Technology 10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method 11 D-band Phased Array Antenna Module for 5G Backhaul 12 Sub-THz Transceiver Design for Future Generation Mobile Communications 13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array 14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends 15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications 16 Post-process Substrate Porosification for RF Applications 17 A Multi-standard RF Bandpass Sigma-Delta ADC 18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies 19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach 20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems 21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond 22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications 23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges 24 Advanced Packaging Solutions for mmWave Applications 25 Modular 3D mmW and THz Packaging Concepts and Technologies 26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands 27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules Index
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Telecommunications;Circuits;Devices
Preface Editors' Biography List of Contributors List of Figures List of Tables 1 B55X: A SHIFT in STMicroelectronics BiCMOS Technologies 2 RF Technology Roadmap for 5G and 6G RF Front-end Systems 3 Advanced Substrate Technologies for Sub-THz Era 4 A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities 5 The Impact of Irradiation on DC Characteristics and
Low-Frequency Noise of Advanced SiGe:C HBTs 6 D-band Modulated Signal Generation using Photonics Techniques 7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024) 8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital?Analog Converters in Coherent Optical Transmission Systems 9 Challenges for 2.5D and 3D Integration of InP HBT Technology 10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method 11 D-band Phased Array Antenna Module for 5G Backhaul 12 Sub-THz Transceiver Design for Future Generation Mobile Communications 13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array 14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends 15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications 16 Post-process Substrate Porosification for RF Applications 17 A Multi-standard RF Bandpass Sigma-Delta ADC 18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies 19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach 20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems 21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond 22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications 23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges 24 Advanced Packaging Solutions for mmWave Applications 25 Modular 3D mmW and THz Packaging Concepts and Technologies 26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands 27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules Index
Low-Frequency Noise of Advanced SiGe:C HBTs 6 D-band Modulated Signal Generation using Photonics Techniques 7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024) 8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital?Analog Converters in Coherent Optical Transmission Systems 9 Challenges for 2.5D and 3D Integration of InP HBT Technology 10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method 11 D-band Phased Array Antenna Module for 5G Backhaul 12 Sub-THz Transceiver Design for Future Generation Mobile Communications 13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array 14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends 15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications 16 Post-process Substrate Porosification for RF Applications 17 A Multi-standard RF Bandpass Sigma-Delta ADC 18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies 19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach 20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems 21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond 22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications 23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges 24 Advanced Packaging Solutions for mmWave Applications 25 Modular 3D mmW and THz Packaging Concepts and Technologies 26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands 27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules Index
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