Direct Copper Interconnection for Advanced Semiconductor Technology

Chapter 1: Advanced Packaging Landscape for Heterogeneous Integration Chapter 2: Direct Copper Interconnection for Die/Wafer Bonding: Overview Chapter 3: Hybrid Bonding Process Technology Chapter 4: Materials for Hybrif Bonding Chapter 5: Copper Electrodeposition for Advanced Packaging and Hybrid Bonding Chapter 6: Planarization for Advanced Packaging and Hybrid Chapter 7: Permanent and Temporary Wafer Bonding Chapter 8: Die-to-Wafer Hybrid Bonding for Direct Copper Intercon Chapter 9: Design for Hybrid Bonding and Chiplets Chapter 10: Thermal Modeling and Simulation for Advanced 3DIC Systems Chapter 11: Characterization, Modeling, and Reliability for Direct Copper Interconnection Chapter 12: Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration

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Direct;Copper;Interconnection;Semiconductor