Advanced Materials and Components for 5G and Beyond

Advanced Materials and Components for 5G and Beyond

Tong, Colin

Springer International Publishing AG

11/2022

261

Dura

Inglês

9783031172069

15 a 20 dias

Descrição não disponível.
Chapter 1. 5G technology components and material solutions for hardware system integration.- Chapter 2. Semiconductor solutions for 5G.- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits.- Chapter 4. PCB materials and design requirements for 5G systems.- Chapter 5. Materials for high frequency filters.- Chapter 6. EMI shielding materials and absorbers for 5G communications.- Chapter 7. Thermal management materials and components for 5G devices.- Chapter 8. Protective packaging and sealing materials for 5G mobile devices.- Chapter 9. Perspectives on 5G and beyond applications and related technologies.
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5G technology;Millimeter wave;THz-enabled sub-system;Autonomous vehicle;Artificial intelligence for wireless communications;Machine learning for wireless communications;Massive multi-input multi-output;Wide-bandgap semiconductor;Nano-antenna;High frequency filter;EMI shielding;Thermal management